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ME 593M
MEMS and Nanotechnology
Spring Semester 2002
General Information
Lectures: Fridays, 4:00 PM - 7:00 PM, HL-102
Instructors:
Cosme Furlong
HL-151
(508) 831-5126
cfurlong@wpi.edu
http://www.wpi.edu/~cfurlong
Ryszard J. Pryputniewicz
HL-152
(508) 831-5536
rjp@wpi.edu
http://www.wpi.edu/~chslt/rjp.html
Textbook:
MEMS & microsystems: design and manufacture, T-R. Hsu, McGraw-Hill, 2002
References:
Notes on MEMS/micromechatronics, R. J. Pryputniewicz, WPI-ME/CHSLT-NEST, 2001
Mechanical microsensors, M. Elwenspoek and R. Wiegerink, Springer-Verlag 2001
Micromachined transducers sourcebook, G. T. A. Kovacs, McGraw-Hill, 1998
Microsystem Design, S. D. Senturia, Kluwer, 2001
Course Description
Course Outline
Week 1
Jan. 15
Class Notes. Introduction to MEMS.
Fundamentals of MEMS design, analysis,
fabrication, NDT, and representative
applications. MEMS for the future.
Suggested Reading: Ch.1, Hsu; Ch.1, RJP
Homework for Lecture 1
Jan. 17
Class Notes. Lithography. Photolithography. Photolithography resolution. Proximity printing. Contact printing.
Modulation transfer function. Spatial coherence.
Resists. Masks. Basic IC process steps. Moore’s
law. Glossary. Sensor market. Microscale and nanoscale devices. Integrated microsystems
Suggested Reading: Ch.8, Hsu; Ch.2, Kovacs
Homework for Lecture 2
Week 2
Jan. 21
Class Notes. Engineering mechanics for microsystems design.
Stress and strain. Residual stresses.
Static bending of thin plates. Mechanical
vibration. Thermomechanics. Fracture
mechanics. Thin-film mechanics. General
materials considerations.
Suggested Reading: Ch.4, Hsu
Homework for Lecture 3
Jan. 24
Class Notes. Continuation of: Engineering mechanics for microsystems design.
Stress and strain. Residual stresses.
Static bending of thin plates. Mechanical
vibration. Thermomechanics. Fracture
mechanics. Thin-film mechanics. General
materials considerations.
Suggested Reading: Ch.4, Hsu
Homework for Lecture 4
Week 3
Feb. 1
Class Notes. Principles of measuring mechanical quantities.
Deformation sensors. Force and pressure sensors.
Resonant sensors. Thermofluid sensors.
Suggested Reading: Ch.2 and 6, Hsu
Homework for Lecture 5
Week 4
Feb. 8
Class Notes. Scaling laws. Sizes of things. Scaling in
geometry. Scaling in dynamic forces. Force
scaling vector. Scaling in acceleration, time,
power, power density. Scaling in electrostatic
forces. The Paschen’s effect. Scaling in
electromagnetics and piezoelectricity. Scaling
in fluidics and heat transfer.
Suggested Reading: Ch.6, Hsu
Homework for Lecture 6
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